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  • High Intensity Small LES 500W Flip Chip COB Module
  • High Intensity Small LES 500W Flip Chip COB Module
  • High Intensity Small LES 500W Flip Chip COB Module

High Intensity Small LES 500W Flip Chip COB Module

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GT-FC500(SP1010)

Power: 500W 

Luminous area:12.84*12.84mm

RoHS compliant 

3 Years Warranty


GT-FC500X3-3.0 Datasheet.pdf


Product Details

Product Description


High Reliability and Stability

Ceramic base with flip chip mounted, no gold wire bonding

High heat conductivity red copper substrate

High temperature eutectic welding technique

Reliable raw materials applied with super fast heat transfer

Patented phosphor coating techonology

 

Outstanding Projecting Performance

High power & lux density with super even light distribution

Minimum distance in-between chips to achieve surface emitting effect

Extremely small LES optimized for focused lighting purpose

 

Flexible Application Features

Equipped with temperature sensor and quick connector

A wide power range from 10W to 800W optional

Application:stage light, projector, searchlight and long-distance lighting applications,etc



Product Specification


Product TypeLES
(mm)
CCT
(K)
CRI φ
(lm)
Power
(W)
VF
(V)
IF
(A)
Chip Array
GT-FC500X3-1.1 12.84*12.848000-85007030000-3500050030-3615SP1010


Product Dimension


High Intensity Small LES 500W Flip Chip COB Module

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