Getian constantly upgrade techniques in flip chip led packaging (no-gold wire bonding) and have accumulated rich technology strength in this field since 2012. Setting our location in high standards as well as good quality and working diligently in there years, Getian have established its own unique professional leading status.
Getian devote to the high density and high brightness flip chip LEDs from 10-800W power, with eutectic bonding packages technique, which ensures the fast conductivity of heat and aims to the lumen maintenance. In addition, small light emitting surface enables light density enhancement, suitable for stage lighting, entertainment lighting, projection lights, moving-Heads, follow spot, etc.
To enrich product category and accommodate customer demand, Getian have launched new products well based on the market-oriented principles. Besides single white color series, mini size LEDs with 20*20mm heatsink from 10-60w for logo projectors.