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What are the main differences between electronic chips and LED chips?

Feb. 16, 2020
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The biggest difference is: 1, the materials are different, the former is silicon-based, the latter is a group of three or five compounds; 2, the former is an integrated device, the latter is a discrete device; 3, the latter requires a higher material defect rate. 3W High Power LED Factory shares with you.

1. The electronic chip is grown on a silicon substrate, and all kinds of photolithography, etching, doping, long film, and oxidation are mainly made of silicon or silicon dioxide; and LEDs are grown on sapphire (Al2O3), SiC or After the buffer layer is grown on the Si substrate, an N-type GaN layer and a P-type GaN layer are grown, and a multi-quantum well light-emitting layer is formed in the middle. When the current passes through the PN junction, the excess energy is emitted in the form of light because of the change in potential energy. The energy of light varies with different potential energy differences, and the performance is different light emission colors (such as blue light, red LED, red light energy). Low technology is simple, it came out many years ago; blue LED has high energy and is difficult. Blue LED excites yellow phosphor to produce white light)

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2. The chip size difference is not too big, such as the order of cm / mm / 0.1mm, but there are very complicated circuits in the same size integrated circuit (commonly said 7nm / 10nm process), the IC design and manufacturing are very similar Complicated and difficult projects, resulting in both design and manufacturing companies such as Intel and Samsung, as well as professional foundries such as Qualcomm, Apple, Fabless, and TSMC; and a die for a discrete device is an independent light source. Adding positive and negative electrodes, the process inside may be 100um / 10um, and the manufacturing process is much simpler. About one hundred steps from beginning to end are almost the same. Not to mention independent LED IC design companies.

3. Chip manufacturers have high requirements for cleanliness and low defect rate. The former may affect performance. There are many defects and the carrier cannot move at the same speed. Like a batch of goods, some can run at 2.8GHz frequency, and some can only Run below 2G; LED chips require light-emitting layer defect rates that are orders of magnitude higher than silicon devices (data in the impression), otherwise the luminous efficiency will be seriously affected, that is, a large part of the energy is lost in the form of thermal energy. LED technology and products have a history of decades, but large-scale use (such as LCD screen backlight) has been the past two decades, the material is not the main cause of low luminous efficiency.

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