30W 12V 2.5A
Vertical Chip & Small LES
High Power & Lux Density
Red Copper Star Substrate with fast heat dissipation.
ALN ceramic chip base with Eutectic Welding technique.
Super small LES, suitable for focused lighting applications such as stage light and projectors.
Flip chip or Osram vertical Chips applied.
High Power density & high lux intensity with ultimate reliability.
Thermal-electric isolation copper substrate, safe and stable, easy for assembly.
Application: LED logo projector; Image projector; Profile light; Moving Head Light; Spot Light; Gobo led lights; Car headlights, etc.